The NWL Series is a superb line-up of semiconductor wafer loaders from Nikon capable of transferring 6″ (150mm) and 8″ (200mm) diameter wafers down to a thickness of 100 microns (option) onto Nikon Eclipse L200N and LV150N microscopes or a NEXIV VMZ-S video measuring system.
Nikon’s outstand proprietary technology makes the NWL200 Series the first line-up of wafer loaders for inspection microscopes capable of leading 100 um thin wafers, providing high throughput and reliability inspection for most applications in the semiconductor industry.
When the power supply is interrupted unexpectedly, the vacuum chuck of the macro arm remains active, allowing safe wafer removal.
Semiconductor wafer front side pattern, back periphery and centre area inspection is supported. The wafer rotation speed and tilt angle are set automatically or manually.
A fast wafer cassette elevator with a non-contact centring mechanism allows rapid, accurate wafer alignment using a multi-arm system for loading and unloading wafers with the highest precision.
The NWL200 is designed ergonomically for easy of operation and control.
Positioned at 35 degrees to the left, wafer in-slot location and full cassette exchange is easy.
A single button selects any wafer from its cassette slot.
The large LCD screen supports rapid interaction with the system controls and recipes.
A structured menu permits easy user dialogue with the system.
Chips are becoming ever thinner through advances in manufacturing, requiring handling of extremely thin wafers.
The NWL200 Series loads ultra-thin wafers to a thickness of 300µm and 200µm as standard, or 100µm as an option.
Dust from friction in the vacuum clamping area, or due to impact when centring wafers or aligning orientation flats or notches, is minimised using an uninterrupted airflow.
The NWL200 cover is made from stainless steel, preventing build-up of static electricity.
Connecting to a customer’s LAN via a web browser wizard interface allows easy interaction to create and back up inspection recipes.
Remotely writing optimised control recipes enables checking of wafer features in a fluid, uninterrupted workflow.
Thin wafers suffer significant distortion.
If sensors are not effective, the wafer may be damaged by the transfer arm.
Nikon's specification and arrangement of sensor beams accurately detects if a thin wafer in the cassette is distorted, aborting its collection.
Nikon's NEXIV VMZ-S series of video measuring systems delivers high accuracy, speed and usability for inspection applications down to the micro level.
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