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XT V 130 and XT V 160
XT V 130 and XT V 160
With sub-micron feature recognition, the XT V system range meets today’s need for high performance, non-destructive inspection of complex electronic components. Nikon’s Xi Nanotech X-ray source paired with industry leading flat panel detectors produces best-in-class image quality, with seamless transition between 2D and 3D inspection.
Superior X-Ray Source
Nikon’s market-leading Xi Nanotech X-ray microfocus source is unique due to its exclusive integral generator design and unparalleled 160kV maximum energy and 20W true-target power.
PCB Analysis Suite
PCB Analysis Suite is capable of advanced measurement and analysis of BGA, bond wires, PTH and complex packages such as PoP on multi-layered boards, with automated pass/fail inspection and reporting.
Oblique Angle Concentric Imaging
Extreme oblique angle field of view up to 90°, with 360° sample rotation, maintains the region of interest thanks to intelligent software and hardware.
The systems are intuitive to use and harness industry-leading software to maximise productivity for all operators, with minimal need for training.
With sub-micron feature recognition, XT V inspection systems are ideal for a wide range of applications in numerous industries, including inspection of PCB assemblies, BGAs, chips, medical, automotive and aerospace components, consumer products and much more.
Cost-effective 130kV system for inspection of electronic components
Premium 160kV system for high accuracy X-ray and CT applications
|Field of View||Field of View|
|CT Ready||CT Ready|
|X.Tract Ready||X.Tract Ready|
Inspect-X for XT V Series
Inspect-X for 3D CT
Non-Electronics Applications for XT V Series
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