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XT V 130 and XT V 160
XT V 130 and XT V 160
With sub-micron feature recognition, the XT V system range meets today’s need for high performance, non-destructive inspection of complex electronic components. Nikon’s Xi Nanotech X-ray source paired with industry leading flat panel detectors produces best-in-class image quality, with seamless transition between 2D and 3D inspection.
Superior X-Ray Source
Nikon’s market-leading Xi Nanotech X-ray microfocus source is unique due to its exclusive integral generator design and unparalleled 160kV maximum energy and 20W true-target power.
Powerful image enhancement
High.Contrast Filter reveals hidden details in the radiography image by providing outstanding image quality of both high and low contrast areas in a single clear image. Operators can now identify all aspects of the sample more quickly than ever before, optimizing and increasing their productivity.
PCB Analysis Suite
PCB Analysis Suite is capable of advanced measurement and analysis of BGA, bond wires, PTH and complex packages such as PoP on multi-layered boards, with automated pass/fail inspection and reporting.
Oblique Angle Concentric Imaging
Extreme oblique angle field of view up to 90°, with 360° sample rotation, maintains the region of interest thanks to intelligent software and hardware.
The systems are intuitive to use and harness industry-leading software to maximise productivity for all operators, with minimal need for training.
With sub-micron feature recognition, XT V inspection systems are ideal for a wide range of applications in numerous industries, including inspection of PCB assemblies, BGAs, chips, medical, automotive and aerospace components, consumer products and much more.
Cost-effective 130kV system for inspection of electronic components
Premium 160kV system for high accuracy X-ray and CT applications
|Field of View||Field of View|
|CT Ready||CT Ready|
|X.Tract Ready||X.Tract Ready|
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